CVE-2019-10502

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670, SD 730, SD 845 / SD 850, SD 855, SDM439, SDX24"}, {"lang": "es", "value": "Un posible desbordamiento de la pila cuando un \u00edndice igual al tama\u00f1o del b\u00fafer io es accedido en el m\u00f3dulo de la c\u00e1mara en los productos Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MSM8909W, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 845 / SD 850, SD 855, SDM439, SDX24."}], "lastModified": "2021-07-21T11:39:23.747", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "FE28A59C-7AA6-4B85-84E8-07852B96108E"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*", "vulnerable": false, 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