CVE-2022-25693

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"2022-09-16T06:15:11.097", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin", "tags": ["Patch", "Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-416"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in graphics due to use-after-free while graphics profiling in Snapdragon Connectivity, Snapdragon Mobile"}, {"lang": "es", "value": "Una corrupci\u00f3n de la memoria en los gr\u00e1ficos debido a un uso de memoria previamente liberada mientras son perfilados los gr\u00e1ficos en Snapdragon Connectivity, Snapdragon Mobile"}], "lastModified": "2023-04-19T17:10:55.030", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": 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