CVE-2022-33217

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"2022-10-19T11:15:11.110", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-120"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile"}, {"lang": "es", "value": "Una corrupci\u00f3n de memoria en Qualcomm IPC debido a una copia del b\u00fafer sin comprobar el tama\u00f1o de la entrada mientras es iniciada la comunicaci\u00f3n con un kernel comprometido. en Snapdragon Mobile"}], "lastModified": "2023-04-19T17:10:55.030", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-:*:*:*:*:*:*:*", "vulnerable": 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